Record Details

Cushion module for stowing electronic equipment
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Author and Affiliation: Rogers, J. R.
Elam, R. M., Jr.
Abstract: To provide vibration-resistance composition adjust processing techniques, which produces essentially void-free materials and provides for clean removal of finished material from mold. Microsphere filler imparts strength to polymer and sodium carbonate imparts flame-resistance.
Publication Date: Jun 01, 1974
Document ID:
19740000073
(Acquired Nov 04, 1995)
Accession Number: 74B10073
Subject Category: MATERIALS
Report/Patent Number: ARC-10779
Document Type: NASA Tech Brief
Publisher Information: United States
Financial Sponsor: NASA; United States
Organization Source: NASA Ames Research Center; Moffett Field, CA, United States
Description: In English
Distribution Limits: Unclassified; Publicly available; Unlimited
Rights: No Copyright
NASA Terms: CUSHIONS; ELECTRONIC EQUIPMENT; ELECTRONIC PACKAGING; MOLDING MATERIALS; POLYMERS; SILICONES; STORAGE STABILITY; VIBRATION ISOLATORS
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